| 摘要 |
A staircase shaped stacked semiconductor package is presented which includes a substrate, a multiplicity of semiconductor chip modules, a connection member, and conductive members. The substrate has connection pads along an upper surface edge. Each semiconductor chip module includes a first and a second semiconductor chip that oppose each other. The first and second semiconductor chips have respective first and second bonding pads along exposed surfaces. The connection member is placed on an uppermost semiconductor chip module and has first and second terminals electrically connected to the first and second bonding pads via conductive members. The conductive members are also coupled to the connection pads of the substrate.
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