CURING COMPOSITIONS HAVING LOW-FREE AMOUNTS OF METHYLENEDIANILINE,申请号WO2010US30159-传众专利搜索

发明名称	CURING COMPOSITIONS HAVING LOW-FREE AMOUNTS OF METHYLENEDIANILINE
摘要	A curing composition of a coordination complex comprising methylenedianiline (MDA) and a salt, and less than 1000 of free MDA. The curing composition may be used in curing polyurethanes and epoxy resins.
申请公布号	WO2010118081(A2)	申请公布日期	2010.10.14
申请号	WO2010US30159	申请日期	2010.04.07
申请人	CHEMTURA CORPORATION;DOYLE, THOMAS, R.;ROSENBERG, RONALD, O.;SHAH, MUKUND	发明人	DOYLE, THOMAS, R.;ROSENBERG, RONALD, O.;SHAH, MUKUND
分类号	C08G18/32	主分类号	C08G18/32
代理机构		代理人
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