发明名称 ELECTRONIC COMPONENT MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component module capable of suppressing propagation to a passive component of a heat generated in a substrate. <P>SOLUTION: In a module 1 for a DC-DC converter as the electronic component module, a through-hole 16a formed on a substrate 3 as a wiring L1 for electrically connecting a terminal 2c as a voltage output terminal for an IC 2 and a terminal 42a for an inductor component 4 and a through-hole 16b formed on the substrate as a wiring L2 for electrically connecting a terminal 2b as a switching terminal for the IC 2 and a terminal 42b for the inductor component 4 are opposed in a direction crossing with a direction (that is, the longitudinal direction of the substrate and the inductor component 4) in which the terminal 42a and the terminal 42b face each other in the inductor component. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010232314(A) 申请公布日期 2010.10.14
申请号 JP20090076586 申请日期 2009.03.26
申请人 TDK CORP 发明人 FURUKAWA HIROTADA;ISHIBASHI MITSURU
分类号 H01L25/00;H01L23/12 主分类号 H01L25/00
代理机构 代理人
主权项
地址