摘要 |
PROBLEM TO BE SOLVED: To provide a wafer holder for a wafer prober that allows positional precision and temperature uniformity to be increased, and also allows the chip to be heated and cooled rapidly, and to provide a wafer prober device mounted with the same. SOLUTION: This wafer holder 1 for a wafer prober: includes a chuck top 2 having a chuck top conductor layer 3 on a surface thereof, and a support 4 for supporting the chuck top 2; and has a cavity in a portion between the chuck top 2 and the support 4. The chuck top 2 preferably includes a heating body 6. COPYRIGHT: (C)2011,JPO&INPIT |