发明名称 METHOD FOR AIR-TIGHTLY SEALING HOLLOW PART FOR VENTILATING HOLE WITH SOLDER
摘要 PROBLEM TO BE SOLVED: To provide a soldering treatment and solder-joining with which a hollow part having thin thickness, wide area and basically no void, can air-tightly be sealed, in a method for air-tightly sealing the hollow part for ventilating hole with solder. SOLUTION: The method for fitting parts comprises: a step of forming an assembly 200 containing first parts 210, second parts 220 and joining materials 230 between the first parts and the second parts; a step characterized by the forming of the hollow parts 240 having the ventilating holes 250 in the first and the second parts; and a step of activating the joining material 230 by heating the assembly 200 so that bubble in the joining material is exhausted to the surroundings of the assembly from the joining material 230 through the hollow part 240 and the ventilating hole 250 during heating treatment. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010228006(A) 申请公布日期 2010.10.14
申请号 JP20100135812 申请日期 2010.06.15
申请人 AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE LTD 发明人 HUMPSTON GILES;ICHIMURA YOSHIKATSU;MAR NANCY M;MILLER DANIEL J;NYSTROM MICHAEL J;TROTT GARY R
分类号 B23K1/14;B23K1/20;B23K1/00;B23K1/008;B23K1/19;B23K31/02;B23K101/36 主分类号 B23K1/14
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