发明名称 |
METHOD FOR MANUFACTURING THIN FILM TRANSISTOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a thin film transistor which reduces production cost and improves productivity using aluminum wiring material with low resistance. SOLUTION: The method for manufacturing the thin film transistor includes steps of: forming a film of pure aluminum or aluminum alloy as a first layer by sputtering using Ar gas; forming a second layer containing aluminum nitride partially in addition to the first layer material, by means of the sputtering using Ar+N2 mixed gas or Ar+NH 3 mixed gas, in the upper layer of the first layer; and electrically connecting a transparent film electrode and a second layer of a first electrode through a contact hole formed separately. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2010232682(A) |
申请公布日期 |
2010.10.14 |
申请号 |
JP20100147793 |
申请日期 |
2010.06.29 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
SAKATA KAZUYUKI;INOUE KAZUNORI;TAKEGUCHI TORU;NAKAMURA NOBUHIRO;YAMADA MASARU |
分类号 |
H01L21/3205;G02F1/1368;G09F9/00;G09F9/30;H01L21/336;H01L21/768;H01L23/52;H01L29/786 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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