| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for dividing a brittle material substrate where, even in a brittle material substrate having a low linear expansion coefficient, the vertical crack of a scribe line is made to elongate to a thickness direction of the substrate by laser beam irradiation. SOLUTION: When a laser beam LB is irradiated along a scribe line 52 formed at a brittle material substrate 50, the brittle material substrate 50 is curved in such a manner that the irradiation side of the laser beam LB is made into a recessed shape. From the viewpoint of securely elongating a vertical crack 53 by the laser beam irradiation, preferably, the curvature radius of the brittle material substrate 50 in the irradiation point of the laser beam LB is controlled to the range of 2,000 to 4,000 mm, and preferably, the irradiation part of the laser beam LB is the bottom part of the brittle material substrate 50. COPYRIGHT: (C)2011,JPO&INPIT
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