发明名称 METHOD OF MANUFACTURING PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for easily removing an inside plated lead line 38 becoming unnecessary after plating when plating a card edge connector 31 in a printed wiring board 30. SOLUTION: A plating processing is performed providing a signal line 39 combining a lead line drawn from each contact 32 inside of the printed wiring board 30, an inside plating lead line 38, and an inside common plating lead line 35 to connect those inside plating lead line 38 for a card edge connector. Since the inside common plating lead line 35 is removed by a milling processing when a plating processing ends, the processing for removing becomes easy regardless of a distance between adjacent contacts 32. Moreover, the inside common plating lead line 35 can be easily removed by one time of milling processing regardless of the number of contact 32. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010232579(A) 申请公布日期 2010.10.14
申请号 JP20090080931 申请日期 2009.03.30
申请人 OKI NETWORKS CO LTD 发明人 SAITO HISASHI
分类号 H05K3/40;H05K3/24 主分类号 H05K3/40
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