| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that an output distribution becomes large since a voltage drop amount in wiring differs at every pixel in a thermal infrared solid-state image pickup element in which diodes are two-dimensionally disposed in a matrix shape and which is driven by a constant current in row units. <P>SOLUTION: The thermal infrared solid-state image pickup element is provided with a variable resistance element (MOS transistor, for example) (101) arranged in pixel pitch units in a vertical power wire (504), a sample and hold circuit (102) holding a potential of the vertical power wire, a second vertical signal line (103) having the same resistance as a vertical signal line, a current source (104) connected to the second vertical signal line, and a circuit (105) controlling a resistance value of the variable resistance element (101) based on the potential of the sample and hold circuit (102) and that of the second vertical signal line (103). <P>COPYRIGHT: (C)2011,JPO&INPIT |
