| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device, capable of improving the uniformity of a film thickness of wiring laid via an upper face of a slope in the electronic device having the slope formed in at least a part of an outer periphery of an electronic component so as to ease a difference in level with a mounting board on which the electronic component is laminated. <P>SOLUTION: In a region where a region in which wiring 40 is laid is overlapped with an inclined face of a slope 30, droplets D2a containing a wiring material are discharged to be isolated each other in the inclined face, and then cured to form suppression dots D2 projecting from an upper face of the slope 30 and being isolated each other. A plurality of droplets D2a formed from liquid containing the wiring material are discharged in the whole region where the wiring 40 is to be laid, and droplets formed by coupling the plurality of droplets D2a thus discharged are cured to form the wiring 40. <P>COPYRIGHT: (C)2011,JPO&INPIT |
