发明名称 THERMOSETTING RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which has good storage stability and the cured product of which has good heat resistance and light resistance, and to provide a printed wiring board and a reflecting plate for a light emitting element using the resin composition. <P>SOLUTION: This thermosetting resin composition is a two component thermosetting resin composition which is used by mixing an agent A with an agent B, wherein the agent A contains a styrene-maleic anhydride copolymer and an organic solvent, and the agent B contains a multifunctional cycloaliphatic epoxy resin and an inorganic filler. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010229221(A) 申请公布日期 2010.10.14
申请号 JP20090076209 申请日期 2009.03.26
申请人 TAIYO INK MFG LTD 发明人 SUMIYA TAKENORI;SHIMAMIYA AYUMI;USHIKI SHIGERU
分类号 C08L63/00;C08G59/20;C08G59/42;C08K3/22;C09D7/12;C09D125/04;C09D135/06;C09D163/00;H01L33/60 主分类号 C08L63/00
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