SUBSTRATE PROCESSING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent deterioration of a sealing member due to thermal radiation from a heater. SOLUTION: This substrate processing apparatus includes: a processing container; a substrate mounting portion which is arranged in the processing container, and on which a substrate is mounted; the heater arranged in the substrate mounting portion and configured to heat the substrate; a thermal radiation attenuation portion adjacent to the processing container; and a gas supply pipe connected to a gas introduction portion through a sealing member for supplying a processing gas to the inside of the processing container therethrough, wherein the thermal radiation attenuation portion is arranged on a line connecting the heater and the sealing member. COPYRIGHT: (C)2011,JPO&INPIT