MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a multilayer printed wring board where reliability of electric connection with respect to thermal shock of a connection part of an interlayer connection member by conductive paste with an interlayer connection member formed of a plated conductor is improved and to provide a manufacturing method of the board. SOLUTION: The wiring board has a first insulating layer 12 and a second insulating layer 22. Circuit wirings 14 and 15 arranged in the respective layers are electrically connected through first and second via holes 16 and 28. The first insulating layer 12 has a first interlayer connection member 18 by conductive paste 17 in the first via hole 16. The second insulating layer 22 has the second via hole 28 formed by penetrating the second insulating layer 22 and circuit wiring 26 by a laser beam. A recess 18a is formed in the first interlayer connection member 18 by the laser beam. Second interlayer connection members 30 by metal plating are arranged in the second via hole 28 and the recess 18a of the first interlayer connection member 18. The first and second interlayer connection members 18 and 30 are connected in the recess 18a. COPYRIGHT: (C)2011,JPO&INPIT