| 摘要 |
PROBLEM TO BE SOLVED: To improve the defect of a conventional method, wherein no image is formed on a face exposed by milling, and any endpoint assignment must be based on an image formed from a surface of a wafer. SOLUTION: An alternative solution is provided to the problems, by an instrument in which only an FIB column is used. For milling a lamella to its final thickness of, for example, 30 nm, a focused ion beam 100 is scanned repeatedly along the lamella. It is found that, while milling the lamella, a signal can be derived from the lamella that is sufficient for end pointing. No additional electron beam for inspection is needed. COPYRIGHT: (C)2011,JPO&INPIT |
