METHOD FOR MANUFACTURING SUBSTRATE FOR PACKAGE, METHOD FOR MANUFACTURING PACKAGE, AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a ceramic package improved in preventing a base plating layer from corrosion. SOLUTION: The method for manufacturing a substrate for a package includes a process 50 preparing an assembled substrate set and a process 48 forming grooves 313 in the assembled substrate set. The assembled substrate set includes a first ceramic layer 111 and a second ceramic layer 112 provided on the first ceramic layer. The second ceramic layer has higher content rate of a glass component than that of the first ceramic layer. The process 48 forming the grooves 313 in the assembled substrate set includes irradiating laser beam along boundaries of a plurality of package regions 31 of the assembled substrate set. COPYRIGHT: (C)2011,JPO&INPIT