| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that when cutting off an array substrate by laser processing, a laser light absorption rate of a member such as ceramics to be used as an insulating substrate is low, and therefore, the intensity of the laser light should be increased or the laser light should be applied for a longer period, so that much heat is generated associated with the laser processing, the characteristics of the insulating substrate and inner wiring included in a wiring board may be changed, and the durability of the wiring board may be reduced. SOLUTION: A method for manufacturing a wiring substrate includes a process for cutting off an insulating substrate having a plurality of wiring substrate areas by laser processing, and further includes: a first process for preparing a substrate provided with the insulating substrate and a metal oxide layer containing a metal oxide whose laser light absorption rate is higher than that of a component composing the insulating substrate as a main component and arranged along a boundary between adjacent wiring board regions on the main surface of the insulating substrate; and a second process for cutting off the substrate along the metal oxide layer by the laser processing. COPYRIGHT: (C)2011,JPO&INPIT
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