SEMICONDUCTOR DEVICE, MOUNTING STRUCTURE AND MOUNTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device of PoP structure or the like, capable of reduction in size and thickness as the whole circuit. SOLUTION: The PoP type semiconductor device S includes: a first package 5 including a semiconductor element 2; a second package 10 laminated on the first package 5. The periphery of the first package 5 is disposed inside the periphery of the second package 10. COPYRIGHT: (C)2011,JPO&INPIT