| 发明名称 |
MANUFACTURING METHOD OF ADVANCED QUAD FLAT NON-LEADED PACKAGE |
| 摘要 |
The manufacturing method of advanced quad flat non-leaded packages includes performing a pre-cutting process prior to the backside etching process for defining the contact terminals. The pre-cutting process ensures the isolation of individual contact terminals and improves the package reliability.
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| 申请公布号 |
US2010258920(A1) |
申请公布日期 |
2010.10.14 |
| 申请号 |
US20090547787 |
申请日期 |
2009.08.26 |
| 申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
CHIEN PAO-HUEI CHANG;HU PING-CHENG;CHIANG PO-SHING;CHENG WEI-LUN |
| 分类号 |
H01L23/495;H01L21/56;H01L21/60 |
主分类号 |
H01L23/495 |
| 代理机构 |
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