发明名称 COMPACT MOLDED LED MODULE
摘要 A method of forming a light emitting diode (LED) module (68) molds an array of lens support frames (42) over an array of connected lead frames (44). LEDs (20, 30) are bonded to the lead frame contacts (12, 14) within the support frames. Molded lenses (48) are then affixed over each support frame, and the lead frames are diced to create individual LED modules (68). In another embodiment, the lenses (80) are molded along with the support frames (82) to create unitary pieces, and the support frames are affixed to the lead frames (72) in the array of connected lead frames. In another embodiment, no lenses are used, and cups (15) are molded with the lead frames (16) so that the LED module (38) is formed solely of the unitary lead frame/cup and the LED. Since each LED enclosure is formed of only one or two separate pieces, and the modules are fabricated on an array scale, the modules can be made very small and simply.
申请公布号 WO2010095068(A3) 申请公布日期 2010.10.14
申请号 WO2010IB50524 申请日期 2010.02.04
申请人 PHILIPS LUMILEDS LIGHTING COMPANY, LLC;KONINKLIJKE PHILIPS ELECTRONICS N.V.;RUDAZ, SERGE LAURENT;BIERHUIZEN, SERGE;HAQUE, ASHIM SHATIL 发明人 RUDAZ, SERGE LAURENT;BIERHUIZEN, SERGE;HAQUE, ASHIM SHATIL
分类号 H01L33/48;G02B17/08;H01L33/58 主分类号 H01L33/48
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