| 摘要 |
PURPOSE: A method for manufacturing a multi layer printed circuit board is provided to prevent the fail of a circuit pattern in advance by changing a manufacturing process. CONSTITUTION: A copper-laminated layer has copper films on both sides(100). A plurality of through holes are formed on the copper-laminated layer(110). The plural through holes are copper-plated on the inner side of the through holes(120). A circuit pattern is formed on the bottom of the copper-laminated layer(130). A thermal conductance insulating member is arranged on the bottom of the copper-laminated layer to laminate an aluminum plate(140). A thermal conductance is filled into the plural through holes(150).
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