发明名称 REACTIVE HOT MELT ADHESIVE COMPOSITION AND METHOD FOR PRODUCING THE SAME
摘要 Disclosed are a reactive hot melt adhesive composition having no problem in the initial adhesive strength, the adhesive strength obtained after moisture curing, stringiness and the like, and a method for producing the same. In the method, 1 to 50 parts by mass of a polymer (A), which is obtained by polymerization of a monomer composition including a vinyl monomer having a carboxyl group and a vinyl monomer having an epoxy group and has the equivalent ratio of the carboxyl group to the epoxy group in the range of 1/100 to 100/1, is mixed with 99 to 50 parts by mass in total of a polyisocyanate (B) and a polyol (C) so that the amount of the isocyanate group can become 1.1 to 10 moles relative to 1 mole of the hydroxyl group of the polyol (C), the sum of the components (A) to (C) being 100 parts by mass, and the resulting mixture is heated and mixed.
申请公布号 US2010258245(A1) 申请公布日期 2010.10.14
申请号 US20090575114 申请日期 2009.10.07
申请人 MITSUBISHI RAYON CO., LTD. 发明人 AKEDA KANA;TERADA KOJI
分类号 C09J5/06;C08F124/00;C08L75/04 主分类号 C09J5/06
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