| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide conductive particles suitable to be used for an anisotropic conductive adhesive, wherein the proportion of such conductive particles that surfaces of resin particles are partially not coated with an electroless plating metal thin film is suppressed as much as possible, the proportion of primary particles (single particles) present without aggregation is high, and projections useful for decreasing a contact resistance are formed on the surfaces. <P>SOLUTION: The conductive particles comprise: resin particles the surfaces of which are subjected to melamine adsorption treatment to adsorb a melamine compound which can self-condense by heating; and an electroless plating metal thin film formed on the surfaces. Further, projections capable of reducing a contact resistance are formed on the surface of the electroless plating metal thin film. The conductive particles are produced by a production method including: a melamine adsorption step of adsorbing a melamine compound to the surfaces of resin particles; a catalyzing step of precipitating a catalyst for accelerating electroless plating; and an electroless plating step of forming a metal thin film by electroless plating. <P>COPYRIGHT: (C)2011,JPO&INPIT |
