| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a double insulating film which seals up the semiconductor element to satisfactorily sustain the sealing performance of the semiconductor element even though damages occur at the corner of a second insulating film because of pelletizing or the like. SOLUTION: Because a corner of a first insulating film 105A of the semiconductor device 100 has been chamfered, damages less affect the corner of the first insulating film 105A even though they occur at the corner of a second insulating film 105B. This satisfactorily maintains the sealing performance of the semiconductor element 107. In addition, a simple structure and high productivity are achieved because chamfering the corner of the second insulating film 105B is not required. COPYRIGHT: (C)2011,JPO&INPIT
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