Method for fixing through hole technology component on side of printed circuit board, involves applying molded part made from hot glue on adhesive area provided on printed circuit board for fixing through hole technology components

摘要

The method involves applying a molded part (5) made from a hot glue on an adhesive area provided on a printed circuit board (1) for fixing through hole technology (THT) components (3). The printed circuit board is mounted with the THT components. The THT components are fixed on the printed circuit board by bonding, where the printed circuit board is heated to a softening temperature of the hot glue. An independent claim is also included for a method for manufacturing a printed circuit board.