PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A package substrate and a method of manufacturing the same are provided to improve heat dissipation efficiency by including a boron nitride of a plate shape. CONSTITUTION: A circuit layer is respectively arranged in both sides of an insulating layer. The insulating layer(110) comprises a thermal conductive insulator and a binder resin. The thermal conductive insulator and the binder resin includes inorganic material powder and a boron nitride covering the outside of the inorganic material powder. A penetration hole(130) passes through the insulating layer. The insulating layer comprises the boron nitride of a plate shape. A solder resist(140) is arranged on the circuit layer.