| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing electronic devices capable of suppressing deformation of a circuit board and a decrease in packaging reliability of electronic components and capable of miniaturizing a physical size in a direction vertical to a thickness direction of the circuit board. <P>SOLUTION: While the circuit board 11 with the electronic components 21 packaged only on a front 11a is being held in a mold cavity such that a back 11b is adhered to an inner surface, resin is filled and hardened, and a first casing 30 for sealing the front 11a of the circuit board 11 and the electronic components 21 packaged on the front 11a is formed such that the back 11b of the circuit board 11 forms one portion of an outer surface. Then, the electronic components 21 are packaged on the back 11b of the circuit board 11. While the circuit board 11 is held in the mold cavity such that an outer surface of the first casing 30 is adhered to an inner surface, resin is filled and hardened, and a second casing 31 for sealing the back 11b of the circuit board 11 and the electronic components 21 packaged on the back 11b is formed to form a casing along with the first casing 30. <P>COPYRIGHT: (C)2011,JPO&INPIT |
