| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, in the structure for mounting an electronic device, in the structure which uses a relay substrate, due to the use of connectors or the like on one surface of the relay substrate depending on the shapes of a module type connected thereto, a physical region on which nothing can be mounted exists on a back surface side thereof, and when the height of the module becomes taller than a connector for connection, physical regions increase by only the space thereof, and the size of the relay substrate become correspondingly larger as these physical regions increase, so that the size of the electronic device becomes large. SOLUTION: In the structure for mounting an electronic device including a plurality of power supply units for supplying electric power to respective logic modules through the relay substrate while a plurality of modules are connected through a plurality of connectors provided on the relay substrate, the relay substrate and the plurality of power supply units are connected by a power source connection substrate provided with a plurality of power supply tabs for connection with the relay substrate and a plurality of connectors for connection with the plurality of power supply units. COPYRIGHT: (C)2011,JPO&INPIT
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