| 摘要 |
A light emitting apparatus includes at least one first substrate, a plurality of light emitting units and a partition structure. The light emitting units are disposed in two-dimension array on the first substrate. Each light emitting unit has at least one light emitting diode (LED) die. The LED die is disposed on the first substrate by wire bonding or flip-chip bonding. The partition structure is disposed correspondingly around each light emitting unit. |
