ELECTRONICS PACKAGE FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE
摘要
<p>An electronics package for an active implantable medical device (AIMD). The electronics package comprises: a biocompatible, electrically non-conductive and fluid impermeable planar substrate usable for semiconductor manufacturing; one or more active components on the surface of the substrate; a biocompatible and fluid impermeable cover bonded to the surface of the substrate to hermetically seal the one or more active components between the substrate and the cover; and a conductive region formed on at least one of an exposed surface of the substrate and the cover electrically connected to at least one of the one or more hermetically sealed active components.</p>
申请公布号
WO2010117382(A1)
申请公布日期
2010.10.14
申请号
WO2009US55405
申请日期
2009.08.28
申请人
NATIONAL ICT AUSTRALIA LIMITED (NICTA);PARKER, JOHN, L.;ROBINSON, DAVID;VERGA, MICHAEL, G.