| 摘要 |
PROBLEM TO BE SOLVED: To hold a substrate to a substrate susceptor with high adhesiveness, in a plasma treating apparatus for disposing, on the susceptor, a tray for storing substrates in its substrate storage holes. SOLUTION: Substrates 2 are stored in the substrate storage holes 19A-19D penetrating a tray 15 in its thickness direction. A dielectric plate 23 in a chamber 3 includes a tray support surface 28 for supporting a lower surface 15c of the tray 15, and substrate placement sections 29A-29D projecting upward, and incorporates an electrode 40 for electrostatic attraction. The substrate placement sections 29A-29D are inserted into the substrate storage holes 19A-19D from the side of a lower surface of the tray 15 and the substrates 2 having warpage are placed on a substrate placement surface, namely the upper end face. The substrate placement surface is in a curved shape. COPYRIGHT: (C)2011,JPO&INPIT |
