发明名称 METHOD FOR FORMING SILICON DOTS
摘要 A method for forming silicon dots which can form silicon dots at a relatively low temperature, with good controllability of the particle diameter of silicon dots depending on the particle diameter of silicon dots to be formed. The method for forming silicon dots comprises producing inductively coupled plasma from a gas for forming silicon dots provided within the plasma producing chamber by applying a high-frequency power to an antenna with reduced inductance placed within the plasma producing chamber to form silicon dots on a substrate S disposed within the chamber in the presence of the inductively coupled plasma. Conditions for a pretreatment of the substrate prior to the formation of silicon dots, the temperature of the substrate in forming silicon dots and the gas pressure in the plasma producing chamber during the formation of silicon dots are controlled depending on the particle diameter of the silicon dots.
申请公布号 US2010260944(A1) 申请公布日期 2010.10.14
申请号 US20080739982 申请日期 2008.10.14
申请人 TOMYO ATSUSHI;KAKI HIROKAZU;TAKAHASHI EIJI 发明人 TOMYO ATSUSHI;KAKI HIROKAZU;TAKAHASHI EIJI
分类号 C23C16/505;C23C16/24 主分类号 C23C16/505
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