Longitudinal link trimming and method for increased link resistance and reliability

摘要

A resistor (14) and a resistive link (1,15) are provided in an integrated circuit structure, and a dielectric layer (30-2) is formed over the resistive link. The resistor and the resistive link are connected in parallel. The resistance of the resistor is trimmed by forming a cut entirely through the resistive link, by advancing a laser beam (3) through a trim region (4,4-1) of the resistive link in a direction at an angle in the range of approximately 0 to 60 degrees relative to a longitudinal axis of the resistive link so as to melt resistive link material. The advancing laser beam tends to sweep the melted material in the direction of beam movement. Re-solidified link debris accumulates sufficiently far apart and sufficiently far from a stub (15A) of the resistive link to prevent significant leakage current in the resistive link.