| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting insulating resin composition having high heat-resistance and low thermal expansion and exhibiting excellent plating adhesion strength; and an insulating film with a substrate, a prepreg, a laminated board, and a multilayer printed wiring board using the same. SOLUTION: Thermosetting insulating resin composition contains: a curing agent (A) having a N-substituted maleimide group and an acidic substituent produced by reacting a maleimide compound (a) having at least two N-substituted maleimide groups in one molecule with an amine compound (b) having an acidic substituent in an organic solvent; an epoxy resin (B) having at least two epoxy groups in one molecule; and a compound (C) capable of chemical roughening. The insulating film with a substrate, the prepreg, the laminated board, and the multilayer printed wiring board uses the thermosetting insulating resin composition. COPYRIGHT: (C)2011,JPO&INPIT |
