| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma processing apparatus for selecting and heating a heating target. SOLUTION: The plasma processing apparatus includes: a focus ring 130 provided near an outer periphery of a mounting table 110a disposed in a processing chamber; and a heating electrode 135 disposed adjacent to the focus ring 130 near the outer periphery of the mounting table 110a, for heating the focus ring 130. Coils 135a1, 135a2 having a first path and a second path are wired close to each other in the heating electrode 135 along the outer periphery of the mounting table 110a. COPYRIGHT: (C)2011,JPO&INPIT
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