发明名称 TEMPERATURE MEASURING INSTRUMENT, THIN FILM FORMING APPARATUS, METHOD OF MEASURING TEMPERATURE AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a temperature measuring instrument for precisely measuring a temperature of an object to be measured which moves complicatedly in a vacuum environment without being affected by heat. SOLUTION: The temperature measuring instrument 5 is provided with: an instrument body 31; an interior package case 33 which houses the instrument body in a fixed state; an exterior package case 35 of which the inner surface dimensions are formed more largely than the outer surface dimensions of the interior package case 33 so as to form a gap between the exterior package case and the interior package case 33; a thermometer 37 which is arranged outside the exterior package case 35 and electrically wired to the instrument body 31 via an insertion hole 33c, 35c of the interior package case 33 and exterior package case 35; and a floating means 49 for floating the interior package case 33 in a non-contact state within the exterior package case 35. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010229498(A) 申请公布日期 2010.10.14
申请号 JP20090078598 申请日期 2009.03.27
申请人 SHINDENGEN ELECTRIC MFG CO LTD 发明人 NAKAMURA AKIHIRO;SATO TOMOYA;TAKIZAWA MASARU;SUEMOTO RYUJI;OSAWA RYOHEI
分类号 C23C14/52;G01K1/02;G01K1/14;H01L21/203;H01L21/205;H01L21/31 主分类号 C23C14/52
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