发明名称 |
TEMPERATURE MEASURING INSTRUMENT, THIN FILM FORMING APPARATUS, METHOD OF MEASURING TEMPERATURE AND SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a temperature measuring instrument for precisely measuring a temperature of an object to be measured which moves complicatedly in a vacuum environment without being affected by heat. SOLUTION: The temperature measuring instrument 5 is provided with: an instrument body 31; an interior package case 33 which houses the instrument body in a fixed state; an exterior package case 35 of which the inner surface dimensions are formed more largely than the outer surface dimensions of the interior package case 33 so as to form a gap between the exterior package case and the interior package case 33; a thermometer 37 which is arranged outside the exterior package case 35 and electrically wired to the instrument body 31 via an insertion hole 33c, 35c of the interior package case 33 and exterior package case 35; and a floating means 49 for floating the interior package case 33 in a non-contact state within the exterior package case 35. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2010229498(A) |
申请公布日期 |
2010.10.14 |
申请号 |
JP20090078598 |
申请日期 |
2009.03.27 |
申请人 |
SHINDENGEN ELECTRIC MFG CO LTD |
发明人 |
NAKAMURA AKIHIRO;SATO TOMOYA;TAKIZAWA MASARU;SUEMOTO RYUJI;OSAWA RYOHEI |
分类号 |
C23C14/52;G01K1/02;G01K1/14;H01L21/203;H01L21/205;H01L21/31 |
主分类号 |
C23C14/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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