| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition for sealing, which secures a desired fluidity and reactivity, and whose cured product has a low glass transition temperature and elastic modulus, and exhibits a suppressed rise in the glass transition temperature and elastic modulus even after exposed to a high-temperature environment; and to provide electronic parts using the same. SOLUTION: The liquid epoxy resin composition for sealing includes an epoxy resin and a curing agent as essential components, wherein the epoxy resin contains 5 to 30 mass% of polyethylene glycol diglycidyl ether to the total amount of the epoxy resin, and the curing agent contains 10 to 20 mass% of a hydrazide compound and 10 to 20 mass% of adipic acid, to the total amount of the epoxy resin. COPYRIGHT: (C)2011,JPO&INPIT
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