| 摘要 |
PROBLEM TO BE SOLVED: To provide a micro device having a highly reliable structure wherein metal members are in excellent contact. SOLUTION: The micro device has a sensor substrate 1 provided with a sensor portion, formed using a semiconductor substrate 10 and having a sensor portion, and a cover substrate 2 bonded to one surface side of the sensor substrate 1. A first connection metal layer 16 is formed on the one surface side of the sensor substrate 1, and a predetermined region enclosing the first connection metal layer 16 is defined as a first bonding region. A second connection metal layer 26 is formed on the surface of the cover substrate 2 on the side of the sensor substrate 1 at a position opposed to the first connection metal layer 16, and a position on the surface of the cover substrate 2, on the side of the sensor substrate 1, which faces the first connection region is defined as a second bonding region. The first connection metal layer 16 and second connection metal layer 26 are eutectically joined together to be electrically connected, the first connection region and the second connection region are connected, the sensor substrate 1 and cover substrate 2 are bonded together to block in the sensor portion. COPYRIGHT: (C)2011,JPO&INPIT |
