发明名称 HVPE CHAMBER HARDWARE
摘要 Embodiments disclosed herein generally relate to an HVPE chamber. The chamber may have two separate precursor sources coupled thereto to permit two separate layers to be deposited. For example, a gallium source and a separate aluminum source may be coupled to the processing chamber to permit gallium nitride and aluminum nitride to be separately deposited onto a substrate in the same processing chamber. The nitrogen may be introduced to the processing chamber at a separate location from the gallium and the aluminum and at a lower temperature. The different temperatures causes the gases to mix together, react and deposit on the substrate with little or no deposition on the chamber walls.
申请公布号 WO2010118293(A2) 申请公布日期 2010.10.14
申请号 WO2010US30492 申请日期 2010.04.09
申请人 APPLIED MATERIALS, INC.;ISHIKAWA, TETSUYA;QUACH, DAVID, H.;CHANG, ANZHONG;KRYLIOUK, OLGA;MELNIK, YURIY;RATIA, HARSUKHDEEP, S.;NGUYEN, SON, T.;PANG, LILY 发明人 ISHIKAWA, TETSUYA;QUACH, DAVID, H.;CHANG, ANZHONG;KRYLIOUK, OLGA;MELNIK, YURIY;RATIA, HARSUKHDEEP, S.;NGUYEN, SON, T.;PANG, LILY
分类号 H01L21/20;H01L33/02 主分类号 H01L21/20
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