| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an image pickup device package reliably maintaining an electric connection between a substrate and a photosensitive semiconductor seating, and also to provide an imaging apparatus. <P>SOLUTION: The image pickup device package is equipped with: a light transmitting substrate 2 including a first metal 6; an element mounting substrate 3 including a second metal and mounting an image pickup device 10 connected to the second metal; a conductive joining member 4 for holding the first metal 6 and the second metal at a prescribed interval and electrically connecting the first metal 6 to the second metal in an outside position of the image pickup device 10; and a sealing layer 5 for sealing an image pickup region 11 of the image pickup device 10. At least one portion of an inside end face 16, namely an end face on the side of the image pickup region 11 of the sealing layer 5, is formed in a fillet shape. <P>COPYRIGHT: (C)2011,JPO&INPIT |
