PHOTOCURABLE THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF THE SAME, AND PRINTED WIRING BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a photocurable thermosetting resin composition excellent in tack-free property of a dried coating film, having high sensitivity and flexibility, and giving a cured product having high flexibility, and to provide a dry film and a cured product of the composition, and a printed wiring board having a cured film of the composition.

SOLUTION: The photocurable thermosetting resin composition includes a carboxyl group-including photosensitive resin (A), a photopolymerization initiator (B) and a thermosetting compound (C). The carboxyl group-including photosensitive resin (A) is obtained by: reacting a compound (b) having one or more isocyanate groups and one or more radical polymerizable double bonds in one molecule with a secondary hydroxyl group of an epoxy resin (a) having two or more epoxy groups and one or more secondary hydroxyl groups in one molecule; reacting a compound (c) having at least one functional group that can react with an epoxy group and having one or more primary hydroxyl groups in one molecule, with an epoxy group of the epoxy resin (a') as a reaction product of the first reaction; and further reacting the resulting reaction product with a polybasic acid anhydride (d).

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