| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition capable of obtaining a cured film excellent in mechanical properties even on firing at a low temperature of not higher than 200°C. <P>SOLUTION: The resin composition includes (a) a polyimide having an alkoxymethyl group or a methylol group, a polybenzoxazole, a polyamide-imide, a precursor thereof or a copolymer thereof and (b) a compound having at least two alkoxymethyl groups or methylol groups. The resin composition further contains (c) a thermal acid generator. Further incorporation of (d) a photoacid generator enables the formation of a positive-type or negative-type pattern or incorporation of (e) a compound having an unsaturated bond and (f) a photoinitiator enables the formation of a negative-type pattern. <P>COPYRIGHT: (C)2011,JPO&INPIT |
