| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a composition for polishing silicon wafers, securing polishing characteristics having improved surface roughness, flatness, and shape stability, while polishing functional materials efficiently. <P>SOLUTION: The composition for polishing silicon wafers includes: an abrasive grain for polishing containing a hydrophobic abrasive grain, namely minute powder treated by abutting on an organosilazane compound including a partial structure shown by a formula (A) in a molecule; and a water-based dispersion medium, where the abrasive grain for polishing is dispersed by 2 mass% or less with reference to the entire mass. In this case, bonding is performed to other parts in a part shown by * in the formula (A). Other parts may be in a structure for connecting a plurality of parts shown by *. X is selected from hydrogen and a hydrocarbon group. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
