| 摘要 |
PROBLEM TO BE SOLVED: To provide solder powder that excels in shape retentivity after removal of a mask in printing and that has excellent sagging prevention including subsequent heating time, and to provide a solder paste using the solder powder. SOLUTION: The solder powder is characterized in that the powder shape is different from a spherical shape but a polygonal shape having at least more than one surface, particularly, a tetrahedron, a hexahedron, an octahedron, and a dodecahedron. Also, the volume accumulation median diameter (Median diameter; D<SB>50</SB>) is suitably less than 5μm. COPYRIGHT: (C)2011,JPO&INPIT |
