| 摘要 |
PROBLEM TO BE SOLVED: To improve the adhesion strength of a conductor pattern for an insulating layer while improving the chemical resistance. SOLUTION: A wiring board includes an insulating layer 1, a chemical resistance layer 2 buried in a surface part of the insulating layer 1, and a conductor pattern 3 formed on the chemical resistance layer 2. The conductor pattern 3 includes a conductor layer 32. A substrate for a probe card includes an insulating layer 1, a chemical resistance layer 2 buried in a surface part of the insulating layer 1, and a conductor pattern 3 formed on the chemical resistance layer 2. The conductor patter 3 includes a conductor layer 32 and is electrically connected to a contactor 4. COPYRIGHT: (C)2011,JPO&INPIT
|
