| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate heat treatment apparatus facilitating the connection of a suction pipe with a heat treatment plate, maintaining heat uniformity within the surface of the heat treatment plate, and improving maintainability such as the inspection and exchange of the heat treatment plate. SOLUTION: This substrate heat treatment apparatus is equipped with: a heat plate 70 where a semiconductor wafer W is placed and heat-treated; a plurality of suction openings 76 formed on the wafer mounting surface of the heat plate 70 to suck the wafer; and a suction pipe 78 that connects each suction opening 76 and a suction means. At one end of the suction pipe 78, a connecting member 77 made of thermally insulated and flexible synthetic rubber is equipped. Then, the connecting member 77 is closely attached to the lower surface of the heat plate 70, and the suction opening 76 and the suction pipe 78 are connected airtightly. COPYRIGHT: (C)2011,JPO&INPIT
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