ELECTROLESS TIN OR TIN ALLOY PLATING LIQUID AND ELECTRONIC PARTS ON WHICH TIN OR TIN ALLOY COATED FILM IS FORMED BY USING THE PLATING LIQUID

摘要

PROBLEM TO BE SOLVED: To provide an electroless tin or tin alloy plating liquid for forming a plating coated film which hardly causes infiltration of plating liquid into the interface between a coverlay film or solder resist and copper or copper alloy, has satisfactory solder wetting property and has preferable bonding reliability between base material and solder. SOLUTION: The electroless tin or tin alloy plating liquid comprises at least a tin salt, a complexing agent and an acid, and further contains: a compound having one or more hydroxyl groups directly bound to a benzene ring; and a polyalkylene glycol compound or a polyalkylene glycol-ether compound prepared by blocking one or more hydroxyl groups of terminals of polyalkylene glycol with alkoxy group. COPYRIGHT: (C)2011,JPO&INPIT