COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING
摘要
<p>A composition comprising a source of metal ions and at least one suppressing agent obtainable by reacting a) an amine compound comprising active amino functional groups with b) a mixture of ethylene oxide and at least one compound selected from C3 and C4 alkylene oxides, said suppressing agent having a molecular weight Mw of 6000 g/mol or more.</p>
申请公布号
WO2010115756(A1)
申请公布日期
2010.10.14
申请号
WO2010EP54108
申请日期
2010.03.29
申请人
BASF SE;ROEGER, CORNELIA;RAETHER, ROMAN BENEDIKT;EMNET, CHARLOTTE;HAAG, ALEXANDRA;MAYER, DIETER
发明人
ROEGER, CORNELIA;RAETHER, ROMAN BENEDIKT;EMNET, CHARLOTTE;HAAG, ALEXANDRA;MAYER, DIETER