发明名称 Compression bonding device
摘要 A compression bonding device capable of packaging electric components on both sides of a substrate is provided. A compression bonding device includes pressing rubbers (85,95). Electric components can be simultaneously packaged on the front face and the rear face of a substrate by sandwiching the substrate between the pressing rubbers (85,95). The electric components are not subjected to a force for horizontally moving them because the pressing rubbers (85,95) are prevented from horizontal extension by a dam member (86). Thus, the electric components are connected to the substrate without misalignment, thereby obtaining a highly reliable electric device.
申请公布号 EP2239131(A1) 申请公布日期 2010.10.13
申请号 EP20100168917 申请日期 2007.02.08
申请人 SONY CHEMICAL & INFORMATION DEVICE CORPORATION 发明人 MATSUMURA, TAKASHI
分类号 B30B5/02;B30B15/06;H01L21/60;H05K3/32 主分类号 B30B5/02
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