发明名称 POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE: A positive photosensitive resin composition, a photosensitive resin film, and a semiconductor device using thereof are provided to secure the excellent sensitivity, resolution, and a residue elimination property of the composition. CONSTITUTION: A positive photosensitive resin composition includes a recurring unit marked with chemical formula 1, a polybenzoxazole precursor including a functional group induced from a substituted or non-substituted monoamine compound, a photosensitive diazoquinone compound, a silane compound, a phenolic compound, and a solvent. In the chemical formula 1, X is either an aromatic organo group or a tetravalent~hexavalent aliphatic organic group.
申请公布号 KR20100110580(A) 申请公布日期 2010.10.13
申请号 KR20090028992 申请日期 2009.04.03
申请人 CHEIL INDUSTRIES INC. 发明人 JUNG, DOO YOUNG;CHO, HYUN YONG;JEONG, JI YOUNG;CHUNG, MIN KOOK;LEE, JONG HWA;YOO, YONG SIK;LEE, KIL SUNG
分类号 G03F7/039 主分类号 G03F7/039
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