摘要 |
PURPOSE: A positive photosensitive resin composition, a photosensitive resin film, and a semiconductor device using thereof are provided to secure the excellent sensitivity, resolution, and a residue elimination property of the composition. CONSTITUTION: A positive photosensitive resin composition includes a recurring unit marked with chemical formula 1, a polybenzoxazole precursor including a functional group induced from a substituted or non-substituted monoamine compound, a photosensitive diazoquinone compound, a silane compound, a phenolic compound, and a solvent. In the chemical formula 1, X is either an aromatic organo group or a tetravalent~hexavalent aliphatic organic group. |
申请人 |
CHEIL INDUSTRIES INC. |
发明人 |
JUNG, DOO YOUNG;CHO, HYUN YONG;JEONG, JI YOUNG;CHUNG, MIN KOOK;LEE, JONG HWA;YOO, YONG SIK;LEE, KIL SUNG |