发明名称 |
ELECTROLYTIC METHOD FOR FILLING HOLES AND CAVITIES WITH METALS |
摘要 |
<p>Disclosed is an electroplating method for filling cavities, through holes, blind holes, or micro blind holes of a work piece with metals. According to said method, the work piece containing cavities, through holes, blind holes, or micro blind holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the work piece and at least one anode such that a current flow is fed to the work piece. The invention method is characterized in that the electrolyte encompasses a redox system.</p> |
申请公布号 |
EP2000013(B1) |
申请公布日期 |
2010.10.13 |
申请号 |
EP20070723814 |
申请日期 |
2007.03.30 |
申请人 |
ATOTECH DEUTSCHLAND GMBH |
发明人 |
REENTS, BERT;ROELFS, BERND;MAGAYA, TAFADZWA;YOUKHANIS, MARKUS;WENZEL, RENE;KIM, SOUNGSOO |
分类号 |
H05K3/42;C25D3/00;C25D5/00;H05K3/18 |
主分类号 |
H05K3/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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